Micromechanical component for a stress sensor and manufacturing method for a micromechanical component for a stress sensor

摘要

The invention relates to a micromechanical component for a stress sensor with a first substrate (10) with a first substrate surface (10a) and a second substrate (12) with a second substrate surface (12a) and one on and / or in the second substrate (12) formed evaluation circuit (20), wherein the first substrate (10) by means of at least one electrical contact (22) formed by means of a metallic bonding process, which is formed within an intermediate volume (14) between the first substrate surface (10a) and the second substrate surface (12a) , is attached to the second substrate (12), and wherein at least one electrode (16, 16a, 16b, 62) and at least one counter electrode (18a, 18b, 18c) are arranged within the intermediate volume (14), the at least one electrode (16, 16a, 16b, 62) and / or the at least one counter electrode (18a, 18b, 18c) via the at least one electrical device formed by means of the metallic bonding process rule contact (22) are electrically connected to the evaluation circuit (20).