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LED chip-based filament and filament lamp

机译:LED芯片丝和灯丝灯

摘要

Lamp filament based on LED chips, characterized by the fact that the filament based on LED chips includes:a connecting medium, where several LED chips are switched in series, parallel or in series and are attached to a connecting medium, for which LED chips of the first type of LED chips, the second type of LED chips and the third type of LED chips are used at least two of them; the wavelength of the emitted light of the first type of LED chip in the range of 445 to 452 nm, the wavelength of the emitted light of the second type of LED chip in the range of 452 to 460 nm and the wavelength of the emitted light of the third type of LED chip in the range of 460 to 472 nm;a first conductive element and a second conductive element, where the first conductive element and the second conductive element are each mounted on the connecting medium and so configured that an external current flows successively through the first conductive element, the LED chips and the second conductive element;a light conversion powder coating covering the multiple LED chips.
机译:基于LED芯片的灯丝,其特征在于,基于LED芯片的灯丝包括:连接介质,其中多个LED芯片串联,并联或串联切换,并连接到连接介质,其中第一类型LED芯片的LED芯片,第二种LED芯片和第三种LED芯片用其中至少两个;第一类型LED芯片的发射光的波长在445至452nm的范围内,第二种类型的LED芯片的发射光的波长在452至460nm的范围内和发光的波长在460至472nm的范围内的第三种LED芯片;第一导电元件和第二导电元件,其中第一导电元件和第二导电元件各自安装在连接介质上,并且因此构造出外部电流连续地通过第一导电元件,LED芯片和第二导电元件流动;覆盖多个LED芯片的光转换粉末涂层。

著录项

  • 公开/公告号DE202021102976U1

    专利类型

  • 公开/公告日2021-08-19

    原文格式PDF

  • 申请/专利权人 ZHEJIANG LEDISON OPTOELECTRONICS CO. LTD.;

    申请/专利号DE202120102976U

  • 发明设计人

    申请日2021-05-31

  • 分类号H01L25/075;H01L33/50;H01L33/62;F21K9/60;

  • 国家 DE

  • 入库时间 2024-06-14 21:58:37

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