Automatic optical inspection of unit specific patterning

摘要

To provide automated optical inspection of suitable unit specific patterning.SOLUTION: A method of automated optical inspection (AOI) for a plurality of unique semiconductor packages can comprise preparing a plurality of semiconductor dies formed as a reconstituted wafer. A plurality of unit specific patterns can be formed by forming a unit specific pattern over each of the semiconductor dies, and each of the unit specific patterns is customized to fit its corresponding semiconductor dies. A plurality of images can be acquired by acquiring an image for each of the unit specific patterns. A plurality of unique reference standards can be created by creating a unique reference standard for each of the unit specific patterns. Defects can be detected in the plurality of unit specific patterns by comparing one of the plurality of unique reference standards to a corresponding one of the plurality of images for each of the unit specific patterns.SELECTED DRAWING: Figure 4