Dense composite material, its manufacturing method, joint body and member for semiconductor manufacturing apparatus

摘要

Problem to be solved: to provide a material having a high sintering property, which has a very small thermal expansion coefficient difference with alumina, and has a high thermal conductivity, densivity and strength.The dense composite material of the present invention contains 43 to 63% by weight of titanium silicide and contains a small amount of silicon carbide and titanium carbide less than the mass% of titanium nitride, and the maximum value of the inter particle distance of silicon carbide is μ The standard deviation is 10 or less, and the opening is less than 1%.No selection