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BIAXIALLY-ORIENTED SIC COMPOSITE SUBSTRATE AND COMPOSITE SUBSTRATE FOR SEMICONDUCTOR DEVICE
BIAXIALLY-ORIENTED SIC COMPOSITE SUBSTRATE AND COMPOSITE SUBSTRATE FOR SEMICONDUCTOR DEVICE
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机译:用于半导体器件的双轴型SiC复合基板和复合基板
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摘要
A biaxially-oriented SiC composite substrate 10 comprises: a first biaxially-oriented SiC layer 20 that includes a threading screw dislocation and a basal plane dislocation; and a second biaxially-oriented SiC layer 30 that is formed continuously from the first biaxially SiC layer 20 and that contains 1×1016 atoms/cm3 - 1×1019 atoms/cm3 of a rare earth element. The defect density of the surface of the second biaxially-oriented SiC layer 30 is smaller than the defect density of the first biaxially-oriented SiC layer 20.
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机译:面向双轴的SiC复合基板10包括:第一双轴取向的SiC层20,其包括螺纹螺钉位错和基础平面位错;和第二双轴取向的SiC层30,其从第一双轴SiC层20连续形成,并且含有1×10 16 原子/ cm 3 sup> - 1×10 < Sup> 19 sup>原子/ cm 3 sup>的稀土元素。第二双轴导向的SiC层30的表面的缺陷密度小于第一双轴取向的SiC层20的缺陷密度。
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