Joining device, joining system, joining method, and computer storage medium

摘要

To properly perform position adjustment on a first holding unit for holding a first substrate and a second holding unit for holding a second substrate and properly perform joint processing between the substrates.SOLUTION: A joining device for joining substrates to each other includes a first holding unit for suctioning and holding a first substrate on a lower surface by vacuuming, a second holding unit which is provided below the first holding unit and suctioning and holding a second substrate on an upper surface by vacuuming, a moving unit for relatively moving the first holding unit and the second holding unit in a horizontal direction, a laser interferometer for measuring the position of the first holding unit or the second holding unit that is moved by the moving unit, a linear scale for measuring the position of the moving unit, and a controller for controlling the moving unit by using a measurement result of the laser interferometer and a measurement result of the linear scale.SELECTED DRAWING: Figure 6