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Multi-fin FINFET device including epitaxial growth barrier on outside surfaces of outermost fins and related methods

机译:多鳍FINFET装置,包括外部鳍片外表面上的外延生长障碍和相关方法

摘要

A multi-fin FINFET device may include a substrate and a plurality of semiconductor fins extending upwardly from the substrate and being spaced apart along the substrate. Each semiconductor fin may have opposing first and second ends and a medial portion therebetween, and outermost fins of the plurality of semiconductor fins may comprise an epitaxial growth barrier on outside surfaces thereof. The FINFET may further include at least one gate overlying the medial portions of the semiconductor fins, a plurality of raised epitaxial semiconductor source regions between the semiconductor fins adjacent the first ends thereof, and a plurality of raised epitaxial semiconductor drain regions between the semiconductor fins adjacent the second ends thereof.
机译:多鳍FinFET装置可包括基板和从基板向上延伸的多个半导体翅片,并沿基板间隔开。每个半导体鳍片可以具有相对的第一和第二端,并且在它们之间形成内侧部分,并且多个半导体翅片的最外侧翅片可以包括在其外表面上的外延生长障碍物。 FINFET还可以包括覆盖半导体鳍片的内侧部分的至少一个栅极,在邻近其第一端的半导体翅片之间的多个凸起的外延半导体源区,以及相邻的半导体翅片之间的多个凸起的外延半导体漏区其第二端。

著录项

  • 公开/公告号US11069682B2

    专利类型

  • 公开/公告日2021-07-20

    原文格式PDF

  • 申请/专利权人 STMICROELECTRONICS INC.;

    申请/专利号US202016751036

  • 发明设计人 QING LIU;PRASANNA KHARE;NICOLAS LOUBET;

    申请日2020-01-23

  • 分类号H01L27/088;H01L21/84;H01L29/66;H01L29/78;H01L29/08;H01L21/265;H01L29/417;H01L21/8238;H01L21/225;H01L21/8234;

  • 国家 US

  • 入库时间 2022-08-24 20:00:57

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