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GAN RECTIFIER SUITABLE FOR OPERATING UNDER 35GHZ ALTERNATING-CURRENT FREQUENCY, AND PREPARATION METHOD THEREFOR

机译:GaN整流器适用于在35GHz交流频率下工作,并制备方法

摘要

The present invention discloses a method for preparing a GaN rectifier suitable for operating at an alternating current frequency of 35 GHz: sequentially growing, on a silicon substrate, an N-polar GaN buffer layer, a carbon doped semi-insulated N-polar GaN layer, a non-doped N-polar AlGaN layer, a non-doped N-polar GaN layer and a non-doped N-polar InGaN thin film to obtain a rectifier epitaxial wafer; preparing a pattern groove for a schottky contact electrode on the GaN rectifier epitaxial wafer, and depositing the schottky contact electrode in the groove; preparing a pattern for an ohmic contact electrode, and depositing a device ohmic contact electrode on the surface of the epitaxial wafer; subsequently, depositing a silicon nitride passivation layer at a part where there is no electrode on the surface of the epitaxial wafer, and preparing a surface electrode area; and finally, performing mesa isolation treatment on the GaN rectifier epitaxial wafer. The present invention realizes the preparation of a high-frequency GaN rectifier, and improves the performance stability of a rectifier device operating at a high power.
机译:本发明公开了一种制备适于以35 GHz的交流频率操作的GaN整流器的方法:在硅衬底上顺序生长,N极GaN缓冲层,碳掺杂半绝缘的N极GaN层,非掺杂的N-极性AlGaN层,非掺杂的N-极性GaN层和非掺杂的N-极性IngaN薄膜,以获得整流器外延晶片;在GaN整流器外延晶片上制备用于肖特基接触电极的图案槽,并在凹槽中沉积肖特基接触电极;为欧姆接触电极制备图案,并在外延晶片表面上沉积装置欧姆接触电极;随后,在外延晶片表面上没有电极的部分处沉积氮化硅钝化层,并制备表面电极区域;最后,对GaN整流器外延晶片进行MESA隔离处理。本发明实现了高频GaN整流器的制备,提高了在高功率下操作的整流装置的性能稳定性。

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