Anisotropic conductive adhesive containing a polysiloxane resin which is a thermoplastic resin, a method of forming solder bumps and a method of manufacturing a bonded structure using the same

摘要

The present invention is a thermoplastic resin polysiloxane resin, siloxane acrylate oligomer, reaction inhibitor; And it relates to an anisotropic conductive adhesive comprising solder particles located in a dispersed state in the polysiloxane resin, wherein the anisotropic conductive adhesive includes a polysiloxane resin that is a thermoplastic resin, a reducing agent used for removing metal oxides from the surface of the solder particles And since there is no network formation of the resin due to the reaction with the additive, it is advantageous for self-organization on the electrode pattern when forming solder bumps and manufacturing the bonding structure, and it is possible to process in the air, and to remove the residual residue after performing the self-organization process Easy.