Adhesive composition, film like adhesive, adhesive layer, adhesive sheet, copper foil with resin, copper clad laminate, printed wiring board, multi-layer wiring board and its manufacturing method

摘要

Problem to be solved: to provide an adhesive composition, a film type adhesive, an adhesive layer, an adhesive sheet, a copper foil with resin, a copper clad laminate, a printed circuit board, and a multilayer wiring board and its manufacturing method.Solution: a reactant (a) of a group of monomers containing an aromatic ring structure and an acid dianhydride (A1) having an alicyclic structure and diamine (A2) containing a dimeric amineCrosslinking agent (b)An adhesive composition comprising a diene polymer (c) andAs a monomer constituting diene polymer (c),12 - containing diene monomer having vinyl structureAdhesive compositionFilm adhesiveAdhesive layerAdhesive sheetCopper foil with resinCopper clad laminatePrinted circuit boardA multilayer wiring board and a method of manufacturing the same.No selection