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MICROMECHANICAL DEVICE WITH ELASTIC ASSEMBLY HAVING VARIABLE ELASTIC CONSTANT

机译:具有弹性组件的微机械装置,具有可变弹性恒定

摘要

A micromechanical device includes a semiconductor body, a first mobile structure, an elastic assembly, coupled to the first mobile structure and to the semiconductor body and adapted to undergo deformation in a direction, and at least one abutment element. The elastic assembly is configured to enable an oscillation of the first mobile structure as a function of a force applied thereto. The first mobile structure, the abutment element and the elastic assembly are arranged with respect to one another in such a way that: when the force is lower than a force threshold, the elastic assembly operates with a first elastic constant; and when the force is greater than the threshold force, then the first mobile structure is in contact with the abutment element, and a deformation of the elastic assembly is generated, which operates with a second elastic constant different from the first elastic constant.
机译:微机械装置包括半导体本体,第一移动结构,弹性组件,耦合到第一移动结构和半导体本体,并适于在方向上进行变形,并且至少一个抵接元件。弹性组件被配置为使第一移动结构的振荡作为施加到其上的力。第一移动结构,抵接元件和弹性组件相对于彼此布置,使得当力低于力阈值时,弹性组件以第一弹性恒定操作;并且当力大于阈值力时,第一移动结构与邻接元件接触,产生弹性组件的变形,从第二弹性常数与第一弹性恒定不同。

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