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THREE-DIMENSIONAL HIGH QUALITY PASSIVE STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY
THREE-DIMENSIONAL HIGH QUALITY PASSIVE STRUCTURE WITH CONDUCTIVE PILLAR TECHNOLOGY
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机译:具有导电柱技术的立体高品质无源结构
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摘要
A passive structure using conductive pillar technology instead of through via technology includes a substrate having a first redistribution layer (RDL) and a three-dimensional (3D) integrated passive device on the substrate. The passive structure includes multiple pillars on the substrate where each of the pillars is taller than the 3D integrated passive device. The passive structure further includes a molding compound on the substrate surrounding the 3D integrated passive device and the pillars. Furthermore, the passive structure includes multiple external interconnects coupled to the first RDL through the pillars.
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