Particles for bonding material and manufacturing method thereof, bonding paste and preparation method thereof, and manufacturing method of bonded body

摘要

As for the particles for bonding material, an organic protective film is formed on the surface of the copper nanoparticles, the BET specific surface area is 3.5 m 2 /g or more and 8 m 2 /g or less, and the BET diameter is in each range of 80 nm or more and 200 nm or less, and the organic protective film is bonded It is contained in the range of 0.5 mass % or more and 2.0 mass % or less with respect to the particle|grains for materials. When particles for a bonding material were analyzed using time-of-flight secondary ion mass spectrometry (TOF-SIMS), the detected amounts of C 3 H 3 O 3− ions and C 3 H 4 O 2−ions were Cu + It is in the range of 0.05 times or more and 0.2 times or less with respect to the detection amount of ions, and the detection amount of C 5 or more ions is in the range of less than 0.005 times the detection amount of Cu + ions.