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Method of suppressing increase in zinc concentration of plating solution and method of manufacturing zinc-based plating member

机译:抑制电镀液锌浓度升高的方法及制造锌基电镀构件的方法

摘要

PROBLEM TO BE SOLVED: To provide a zinc-based plating apparatus in which a zinc ion concentration is unlikely to increase when the anode is soluble, and a method for manufacturing a zinc-based plating member using such a zinc-based plating apparatus. SOLUTION: A plating tank 10 capable of accommodating a plating solution PE, a first diaphragm tank 20 capable of accommodating a first electrolytic solution and having a first diaphragm 21 including a first ion exchange membrane, and the above when in use. A cathode holding member 30 for cathodic electrolysis of a member to be plated that comes into contact with the plating solution inside the plating tank, and a soluble zinc-containing member 41 that comes into contact with the first electrolytic solution inside the first diaphragm tank during use. A first anode holding member 40 for anodic electrolysis is provided so that the first electrolytic solution comes into contact with one surface of the first diaphragm and the plating solution comes into contact with the other surface of the first diaphragm during use. In addition, the zinc-based plating apparatus 100 is characterized in that the first diaphragm tank is arranged. [Selection diagram] Fig. 1
机译:要解决的问题:提供一种基于锌的电镀装置,其中阳极可溶的锌离子浓度不太可能增加,以及使用这种锌基电镀装置制造基于锌基电镀构件的方法。溶液:能够容纳电镀液PE的电镀槽10,能够容纳第一电解液并具有包括第一离子交换膜的第一隔膜21的第一隔膜罐20,以及在使用中的上述第一隔膜21。用于连接待镀件的构件的阴极保持构件30,其与电镀罐内的电镀溶液接触,以及在第一隔膜槽内的第一电解溶液接触的可溶性锌的构件41采用。提供用于阳极电解的第一阳极保持构件40,使得第一电解溶液与第一隔膜的一个表面接触,并且在使用期间,电镀溶液与第一隔膜的另一个表面接触。另外,锌基电镀装置100的特征在于,布置第一膜片罐。 [选择图]图1

著录项

  • 公开/公告号JP2021085068A

    专利类型

  • 公开/公告日2021-06-03

    原文格式PDF

  • 申请/专利权人 ユケン工業株式会社;

    申请/专利号JP20190214897

  • 发明设计人 杉浦 寿裕;青木 泰紀;

    申请日2019-11-28

  • 分类号C25D17;C25D17/10;C25D17/12;C25D3/56;

  • 国家 JP

  • 入库时间 2024-06-14 21:38:45

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