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Power Module and Substrate Structure Applied to Power Modules

机译:电源模块和基板结构应用于电源模块

摘要

A substrate structure applied to a power module according to an embodiment of the present invention is provided. A substrate applied to the power module includes an upper substrate and a lower substrate, and the lower substrate includes device regions on which a plurality of semiconductor devices are disposed, a source signal electrode unit for transmitting a source signal to the semiconductor devices, and the semiconductor devices. a gate signal electrode part for transmitting a raw gate signal, wherein either the source signal electrode part or the gate signal electrode part is connected to the upper substrate through a conductive pillar, and the source signal electrode part or the gate signal electrode part A signal transmitted by any one is transmitted to the semiconductor devices through the upper substrate.
机译:提供了施加到根据本发明的实施例的基板结构。施加到电源模块的基板包括上基板和下基板,下基板包括设置有多个半导体器件的装置区域,用于将源信号传输到半导体器件的源信号电极单元,以及半导体器件。用于发送原始栅极信号的栅极信号电极部分,其中源信号电极部分或栅极信号电极部分通过导电柱连接到上基板,源信号电极部分或栅极信号电极部分是信号由任何一个传输通过上基板传输到半导体器件。

著录项

  • 公开/公告号KR20210063734A

    专利类型

  • 公开/公告日2021-06-02

    原文格式PDF

  • 申请/专利权人 현대자동차주식회사;기아 주식회사;

    申请/专利号KR1020190152208

  • 发明设计人 홍경국;김영석;

    申请日2019-11-25

  • 分类号H01L23/14;H01L23;H01L23/49;H01L23/495;H01L25/065;H01L25/16;

  • 国家 KR

  • 入库时间 2022-08-24 19:12:10

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