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Jig for chip electronic component

机译:芯片电子元件的夹具

摘要

Problem to be solved: to provide uniform processing for all of the plurality of chip like electronic parts held therein in a jig for chip like electronic parts in which a plurality of chip accommodating portions are arranged in two directions in the X and Y directions.The specific chip accommodating portion 13a of the plurality of chip accommodating portions 13 is structured so that the chip like electronic component 12 can not be accommodated.For example, a plurality of X-direction linear members X1 and a plurality of Y-direction linear members Y1 defining an opening 16 for receiving the chip like electronic component 12 are deformed to form an opening 16A in which an area is reduced so that the chip like electronic component 12 can not be accommodated.For example, the chip like electronic component 12 may not be contained in the chip storage portion 13a to which a specific temperature condition or unique aeration is given in the process of firing or the like. Uniform processing can be performed for all of the plurality of chip like electronic parts 12 held in the jig 11 for chip electronic parts.Diagram
机译:要解决的问题:为在夹具的夹具中提供用于其中的电子部件的所有多个芯片的均匀处理,其中多个芯片容纳部分在X和Y方向上沿两个方向布置。多个芯片容纳部分13的特定芯片容纳部分13a被构造成使得芯片如图所示的芯片可以不容纳。例如,多个X方向线性构件X1和多个Y方向线性构件用于接收芯片的开口16的Y1变形以形成一个开口16a,其中区域减小,使得可以不容纳电子部件12这样的芯片。例如,芯片可能不是包含在燃烧等过程中特定温度条件或独特曝气的芯片存储部分13a中。可以对芯片电子零件的夹具11中保持的电子部件12中的所有多个芯片执行均匀的处理.diagram

著录项

  • 公开/公告号JP2021089920A

    专利类型

  • 公开/公告日2021-06-10

    原文格式PDF

  • 申请/专利权人 株式会社村田製作所;

    申请/专利号JP20190218434

  • 发明设计人 田中 雄太;

    申请日2019-12-03

  • 分类号H01G13;F27D3/12;

  • 国家 JP

  • 入库时间 2022-08-24 19:09:06

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