A method of manufacturing a detection device comprising a direct bonding step of a thin sealing layer provided with a getter material

摘要

The invention relates to a method of manufacturing a thermal detector (1) comprising the following steps: production of a first stack (10) comprising a thermal detector (20), a mineral sacrificial layer (15) and a thin encapsulation layer (16) having a side vent (17.1); production of a second stack (30) comprising a thin sealing layer (33) and a getter portion (34); removal of the mineral sacrificial layer (15); assembly by direct bonding of the thin sealing layer (33) brought into contact with the thin encapsulation layer (16) and closing off the side vent (17.1), the getter portion (34) being located in the side vent ( 17.1). Figure for the abstract: Fig. 1F