Semiconductor packaging device, comprising:a transistor unit (31) having a first page (32), the first page having a source electrode (33) and a gate electrode (34);a Chip Island (37) having a first surface (38); anda first surface (40) with a connection (39), with a first conductive part (48, 49) between the source electrode (33) and the first surface (38) of the chip island (37) separated the source electrode (33) from the first surface (38) of the chip island (37) by a distance (d1), greater than a distance (d2) between the gate electrode (34) and the first surface (40) of the connection (39),where the first conductive part (48, 49) has a first section (48) with a first melting point and a second section (39) with a second melting point,where the second melting point is lower than the first melting point; andwhere the first area (48) and the second area (49) are in contact with the source electrode (33) and the first surface (38) of the chip island (37).
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