Coordinate position determination accuracy calibration method of laser surface inspection apparatus and evaluation method of semiconductor wafer

摘要

Problem to be solved: to provide a new method for improving detection accuracy of LPD by laser surface inspection equipment.A method of calibrating the coordinate position determination accuracy of a laser surface inspection apparatus for detecting LPD on the surface of the wafer by scanning a laser beam while rotating the semiconductor wafer while scanning the semiconductor wafer.Cop on the surface of the reference waferLaser surface inspection equipmentAn apparatus for calibrating an X coordinate position and a Y coordinate position of the above cop in a two-dimensional orthogonal coordinate system and a calibration systemAndThe difference in position between the detection position obtained by the laser surface inspection apparatus for calibration on the surface of the reference wafer and the detection position obtained by the calibration device is within the threshold rangeAs a criterion for determining that the cop detected by each device is the same copDetermine the cop detected as the same cop by the laser surface inspection device and calibration device to be calibratedAndX and Y coordinate positions of the same cop and the determined copThe X coordinate position and Y coordinate position obtained by the calibration device are adopted as true values.Calibration of the coordinate position determination accuracy of a laser surface inspection apparatus to be calibrated.No selection