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A method for pretreating surfaces for coating

机译:一种用于涂层的预处理表面的方法

摘要

Exposing the substrate to a rare gas ion selected from the group of metal ions and argon ions, krypton ions, neon ions, xenon ions and helium ions in a vacuum chamber (10); and negative electrical potential on the substrate (1) A method for pretreating a substrate (200) for surface coating by applying (P1, P2), wherein the substrate (200) is pretreated in at least two steps (1000, 2000); These steps are performed sequentially in the vacuum chamber (10), and the first step (1000) is performed from the group of argon ions, krypton ions, neon ions, xenon ions and helium ions in the vacuum chamber (10). Supplying a plasma mainly containing selected rare gas ions, and a substrate ( 00) applying a first negative electrical potential (P1) onto the second step (2000) supplying a plasma mainly comprising metal ions in the vacuum chamber (10); Applying a second negative electric potential (P2) on the substrate (200), wherein the first negative electric potential (P1) is lower than the second electric potential (P2). Applying a potential (P2), the method for pretreating a substrate (200) for surface coating, wherein the magnitude of the first negative potential (P1) is 100-1500V. [Selection] Figure 1
机译:将基材暴露于从金属离子和氩离子,氪离子,氖离子,氙离子和真空室(10)中的氦离子中选择的稀有气体离子;衬底上的负电电位(1)通过施加(P1,P2)来预处理用于表面涂层的基板(200)的方法,其中在至少两个步骤(1000,2000)中预处理基板(200);这些步骤在真空室(10)中顺序进行,第一步(1000)从氩离子组,氪离子,氖离子,氙离子和真空室(10)中的氦离子进行。供应主要含有选定的稀有气体离子的等离子体,以及将第一负电电位(P1)施加到第二步骤(2000)上的基材(00),供应具有真空室(10)中的金属离子的等离子体;在基板(200)上施加第二负电位(P2),其中第一负电位(P1)低于第二电位(P2)。施加电位(P2),用于预处理表面涂层的基板(200)的方法,其中第一负电位(P1)的大小为100-1500V。 [选择]图1

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