Curable silicone gel composition, silicone gel curable material and method for protecting electrical / electronic component

摘要

PROBLEM TO BE SOLVED: To provide a curable silicone gel composition capable of being quickly cured at comparatively low temperature, and capable of providing a silicone gel cured product which has less variation in a loss coefficient (tanδ) even at a various shear frequency of 0.1 Hz to 100 Hz, for instance on the condition of 23°C.;SOLUTION: The curable silicone gel composition is provided that is obtained using a straight chain organopolysiloxane having one silicon atom-bonding vinyl group at each of both terminals of a molecular chain as a base polymer, adding a small amount of the straight chain organopolysiloxane having three silicon atom-bonding vinyl groups at each of both terminals of a molecular chain having a comparatively high viscosity to the straight chain organopolysiloxane, and curing the above two kinds of organopolysiloxane and organohydrogen polysiloxane under the presence of an addition reaction catalyst.;SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT