Back Up Integrated Bonding Stage Having Ball Rolling Type theta Alignment Function

摘要

The present invention provides a uniform theta alignment structure and a backup ball contact rolling structure when bonding films and chips to a flexible panel or a rigid panel, thereby effectively reducing alignment accuracy and sagging of bonding fixing. A bonding stage for supporting thermocompression bonding of a bonding head while supporting a panel on which a film is pre-mounted, positioned in correspondence with a bonding device among display manufacturing equipment, to provide a protection box, comprising: a base plate; A main stage supporting the panel on the upper surface from the top in a vacuum suction state, a main driving unit installed on the base plate and driving the main stage to flow in the θ-axis direction, and rotatable on the main driving unit A main stage unit configured to include a turntable installed and supporting and fixing the main stage thereon; A backup stage that adsorbs and supports the bonding area of the film among the panels on the upper side, and a backup guide block that fixes the backup stage and connects to the upper front of the turntable to support and fix the backup stage so that the θ-axis alignment is possible, and the base A backup support block that is fixedly installed on a plate and supports the load applied to the backup stage while contacting and guiding the rotation of the turntable, and a backup support block that is fixedly installed on the upper side of the backup support block, and is in ball contact with the lower surface of the backup guide block. It provides a backup-integrated bonding stage having a ball contact type theta alignment function comprising; a backup stage unit including a steel ball guide unit formed to be flowable.