BUSBAR LAMINATE, ELECTRONIC COMPONENT MOUNTING MODULE INCLUDING SAME, AND METHOD OF MANUFACTURING BUSBAR LAMINATE

摘要

It was possible to use reflow solder by aligning the height of the solder mounting surface with the bus bar and the cathode of the stacked anode, and an object thereof is to provide a surface mount type electronic component module or the like using a bus bar. A bus bar stacked body in which a first bus bar and a second bus bar each having a region for soldering external terminals of an electronic component are laminated in an insulated manner, wherein the first bus bar includes an opening, the second bus bar includes a protrusion body projecting toward the first bus bar side and serving as a region for soldering, and the protrusion body of the second bus bar is disposed at a position corresponding to the opening, and the region for soldering the first bus bar and the region for soldering the protrusion body are formed as a bus bar stacked body having the same height to the extent that soldering of external terminals of the electronic component by reflow soldering is possible.