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PACKAGED ASSEMBLY FOR HIGH DENSITY POWER APPLICATIONS
PACKAGED ASSEMBLY FOR HIGH DENSITY POWER APPLICATIONS
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机译:用于高密度功率应用的包装组件
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摘要
A packaged assembly for high density power applications includes a case having shelves on opposing walls, and a double-sided substrate disposed on the shelves of the case, the double-sided substrate having a semiconductor die on a first side of the double-sided substrate and circuit elements on a second side of the double-sided substrate. The case includes aluminum silicon (AlSi). The double-sided substrate is secured to the case by an epoxy. The double-sided substrate a thick film substrate and includes beryllium oxide (BeO) or aluminum oxide (Al2O3). The semiconductor die on the first side of the double-sided substrate is coupled to at least one of the circuit elements on the second side of the double-sided substrate by a through substrate via. The packaged assembly also further includes invertible leads coupled to the double-sided substrate by lead frames.
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机译:用于高密度功率应用的封装组件包括在相对壁上具有搁架的壳体,以及设置在壳体的架子上的双面基板,双面基板在双面基板的第一侧具有半导体管芯和双面基板的第二侧上的电路元件。这种情况包括铝硅(Alsi)。双面基板通过环氧树脂固定到壳体上。双面基板是厚膜基材,包括氧化铍(甜菜)或氧化铝(Al 2 sub> O 3 sub>)。双面基板第一侧上的半导体管芯通过通过基板通孔通过通过基板耦合到双面基板的第二侧上的至少一个电路元件。包装组件还包括通过引线框架耦合到双面基板的可逆导线。
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