首页> 外国专利> FORMATION OF MICROLED MESA STRUCTURES WITH ATOMIC LAYER DEPOSITION PASSIVATED SIDEWALLS, A SELF-ALIGNED DIELECTRIC VIA TO THE TOP ELECTRICAL CONTACT, AND A PLASMA-DAMAGE-FREE TOP CONTACT

FORMATION OF MICROLED MESA STRUCTURES WITH ATOMIC LAYER DEPOSITION PASSIVATED SIDEWALLS, A SELF-ALIGNED DIELECTRIC VIA TO THE TOP ELECTRICAL CONTACT, AND A PLASMA-DAMAGE-FREE TOP CONTACT

机译:用原子层沉积钝化侧壁形成微循环结构,自对准介电通孔到顶部电触点,以及自由损伤的顶部接触

摘要

A micro light emitting diode including a mesa comprising an epitaxial structure and having a top surface with an area less than 10 micrometers by 10 micrometers, less than 1 micrometer by 1 micrometer, or less than 0.5 micrometers by 0.5 micrometers; a dielectric on the top surface; and a via hole in the dielectric that is centered or self aligned on the top surface, e.g., perfectly centered or centered within 0.5% of the center of the top surface. In one or more examples, the micro light emitting diode is plasma damage free. Metallization in the via hole is used to electrically contact the micro light emitting diode.
机译:微发光二极管,包括包括外延结构的台面,并且具有面积小于10微米的顶表面10微米,小于1微米,或小于0.5微米的区域;顶表面上的电介质;和在顶表面上以中心或自对准的电介质中的通孔,例如,在顶表面的中心的0.5%内完美为中心或以0.5%为中心。在一个或多个例子中,微发光二极管是自由的等离子体损坏。通孔中的金属化用于电接触微发光二极管。

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