Visualization and modeling of thermomechanical stresses using photoluminescence

摘要

PROBLEM TO BE SOLVED: To visualize and model a thermomechanical stress on a semiconductor chip by using a system and a method for detecting the thermomechanical stress on the semiconductor chip, more specifically, using photoluminescence. Provide systems and methods for doing so. An electronic system may include a substrate, an electronic device bonded to the substrate, a plurality of photoluminescent particles arranged on the electronic device, an illuminator, a sensor, and a control module. The illuminator can illuminate the electronic device. The sensor captures a first set of positions of photoluminescent particles on the electronic device when the electronic device is under load and is not operating, and is light when the electronic device is under load and is operating. A second set of luminescence particle positions can be captured. The control module can determine the thermomechanical stresses on the electronic device, at least in part, based on the difference between the first set of positions and the second set of positions. [Selection diagram] Fig. 1