首页> 外国专利> A HEATING STRUCTURE CONFIGURED TO IMPROVE HEAT EFFICIENCY IN A MODULATOR DEVICE

A HEATING STRUCTURE CONFIGURED TO IMPROVE HEAT EFFICIENCY IN A MODULATOR DEVICE

机译:一种加热结构,被配置为提高调制器装置中的热效率

摘要

Various embodiments of this disclosure are directed to a modulator device that includes a first waveguide and a heater structure. An input terminal is configured to receive incident light. The first waveguide has a first input region and a first output region coupled to the input terminal. A second waveguide is optically coupled to the first waveguide. The second waveguide has a second input region and a second output region coupled to the input terminal. An output terminal is configured to provide outgoing light that is modulated based on the incoming light. The output terminal is coupled to the first output region and the second output region. The heating structure lies over the first waveguide. A lower surface of the heater structure is aligned with a lower surface of the first waveguide. The first waveguide has a lateral spacing between side walls of the heating structure.
机译:本公开的各种实施例涉及一种调制器装置,其包括第一波导和加热器结构。输入终端被配置为接收入射光。第一波导具有第一输入区域和耦合到输入端子的第一输出区域。第二波导光学耦合到第一波导。第二波导具有第二输入区域和耦合到输入端子的第二输出区域。输出端子被配置为提供基于输入光调制的输出光。输出端子耦合到第一输出区域和第二输出区域。加热结构位于第一波导上。加热器结构的下表面与第一波导的下表面对准。第一波导具有在加热结构的侧壁之间具有横向间隔。

著录项

  • 公开/公告号DE102020101261A1

    专利类型

  • 公开/公告日2021-05-06

    原文格式PDF

  • 申请/专利权人 TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD.;

    申请/专利号DE202010101261

  • 发明设计人 SHIH-WEI LIN;MING CHYI LIU;

    申请日2020-01-21

  • 分类号G02F1/01;G02B6/12;G02B6/122;H04B10/25;

  • 国家 DE

  • 入库时间 2022-08-24 18:35:48

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