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Package with cathodic protection for corrosion mitigation
Package with cathodic protection for corrosion mitigation
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机译:带阴极保护腐蚀缓解的包装
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摘要
An apparatus is provided which comprises: a substrate to couple with one or more integrated circuit die(s), an integrated circuit die coupled to the substrate, a metal component coupled to the substrate, wherein the metal component lacks a sealing coating, and a sacrificial metal conductively coupled with the metal component, wherein the sacrificial metal comprises a more anodic metal than the metal component. Other embodiments are also disclosed and claimed.
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