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Fiber encapsulation mechanism for energy dissipation in a fiber amplifying system

机译:纤维放大系统中耗能的光纤封装机制

摘要

The present disclosure relates to a fiber encapsulation mechanism for energy dissipation in a fiber amplifying system. One example embodiment includes an optical fiber amplifier. The optical fiber amplifier includes an optical fiber that includes a gain medium, as well as a polymer layer that at least partially surrounds the optical fiber. The polymer layer is optically transparent. In addition, the optical fiber amplifier includes a pump source. Optical pumping by the pump source amplifies optical signals in the optical fiber and generates excess heat and excess photons. The optical fiber amplifier additionally includes a heatsink layer disposed adjacent to the polymer layer. The heatsink layer conducts the excess heat away from the optical fiber. Further, the optical fiber amplifier includes an optically transparent layer disposed adjacent to the polymer layer. The optically transparent layer transmits the excess photons away from the optical fiber.
机译:本公开涉及一种用于光纤放大系统中的能量耗散的光纤封装机构。一个示例实施例包括光纤放大器。光纤放大器包括光纤,其包括增益介质,以及至少部分地围绕光纤的聚合物层。聚合物层是光学透明的。另外,光纤放大器包括泵源。泵浦源的光学泵浦在光纤中放大光学信号,并产生过量的热量和过量的光子。光纤放大器另外包括邻近聚合物层设置的散热层。散热层传导远离光纤的过热。此外,光纤放大器包括与聚合物层相邻设置的光学透明层。光学透明层将多余的光子传输远离光纤。

著录项

  • 公开/公告号US10992096B2

    专利类型

  • 公开/公告日2021-04-27

    原文格式PDF

  • 申请/专利权人 WAYMO LLC;

    申请/专利号US201815972680

  • 申请日2018-05-07

  • 分类号H01S3/04;G01S7/481;H01S3/067;G02B6/02;G02B6/255;H01S3/16;G01S17/02;H01S3/094;H01S3/042;H01S3/08;H01S3;G01S17/10;H01S3/0941;

  • 国家 US

  • 入库时间 2022-08-24 18:23:10

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