首页> 外国专利> HIGH TEMPERATURE SUPERCONDUCTOR HAVING MULTIPLE SUPERCONDUCTING LAYERS, AND HIGH TEMPERATURE SUPERCONDUCTOR MANUFACTURING METHOD FOR SAME

HIGH TEMPERATURE SUPERCONDUCTOR HAVING MULTIPLE SUPERCONDUCTING LAYERS, AND HIGH TEMPERATURE SUPERCONDUCTOR MANUFACTURING METHOD FOR SAME

机译:具有多个超导层的高温超导体,以及相同的高温超导体制造方法

摘要

The present invention relates to a method for manufacturing a high temperature superconductor, and a high temperature superconductor having multiple superconducting layers using same. The present invention comprises: a stacking step for stacking superconductors such that protection layers of a pair of superconductors including at least a substrate-superconducting layer-protection layer face each other; a bonding step for heat-treating the stacked pair of superconductors such that the protection layers facing each other are diffusion-bonded to each other to form a bonded protection layer; a peeling step for removing a layered structure on the upper side of a superconducting layer on one side of the superconductor on which the bonded protection layer is formed, thereby exposing the superconducting layer to the outside; and an outermost protection layer forming step for forming an outer protection layer, made of the same material as the bonded protection layer, on the upper side of the superconducting layer exposed to the outside through the peeling step. According to the present invention, it is possible to form multiple superconducting layers by easily stacking additional superconducting layers according to the required current density, and paste of the same material as the protection layers can be filled into gaps between the stacked protection layers through a paste filling process and heat-treated together with the protection layers, such that there is an advantage in that the superconducting layer and the substrate can be effectively separated in the process of peeling the substrate.
机译:本发明涉及一种用于制造高温超导体的方法,以及具有相同的多个超导层的高温超导体。本发明包括:用于堆叠超导体的堆叠步骤,使得一对超导体的保护层包括至少一种基板超导层保护层;用于热处理堆叠的超导体的粘合步骤,使得彼此面对的保护层彼此扩散以形成粘合的保护层;形成在形成粘合保护层的超导体的一侧上的超导层的上侧上的层状结构的剥离步骤,从而将超导层暴露于外部;并且,用于形成由与粘合保护层相同的材料制成的外保护层的最外层保护层形成步骤,在通过剥离步骤暴露于外部的超导层的上侧。根据本发明,可以通过根据所需电流密度容易地堆叠附加的超导层来形成多个超导层,并且与保护层相同的材料的糊状物可以通过浆料填充到堆叠的保护层之间的间隙中填充过程和与保护层一起热处理,使得存在优点在于,在剥离基板的过程中可以有效地分离超导层和基板。

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