首页> 外国专利> HIGH EFFICIENCY VERTICAL GRATING COUPLER FOR FLIP-CHIP APPLICATION

HIGH EFFICIENCY VERTICAL GRATING COUPLER FOR FLIP-CHIP APPLICATION

机译:用于倒装芯片应用的高效率垂直光栅耦合器

摘要

A method and system for forming a photonic device. A photonic device may include a substrate, a cladding layer disposed on the substrate, an electrical device region formed within the cladding layer, the electrical device region having a plurality of electrical device component layers that include at least one metal layer, and a grating region formed within the cladding layer, the grating region including a grating coupler and the at least one metal layer. The at least one metal layer is deposited simultaneously in the electrical device and grating regions and is used in the grating region to reflect light emitted from the grating coupler.
机译:一种形成光子器件的方法和系统。光子器件可包括基板,设置在基板上的包层,该电气装置区域形成在包层内,电气装置区域具有包括至少一个金属层的多个电气装置组件层和光栅区域形成在包层层内,光栅区域包括光栅耦合器和至少一个金属层。在电气设备和光栅区域中同时沉积至少一个金属层,并用于光栅区域以反射从光栅耦合器发射的光。

著录项

  • 公开/公告号WO2021061886A1

    专利类型

  • 公开/公告日2021-04-01

    原文格式PDF

  • 申请/专利权人 IPG PHOTONICS CORPORATION;

    申请/专利号WO2020US52361

  • 发明设计人 DE VALICOURT GUILHEM;KOSSEY MICHAEL;

    申请日2020-09-24

  • 分类号G02B6/13;

  • 国家 US

  • 入库时间 2022-08-24 18:03:17

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号