Mycelium with reduced friction coefficient and abrasion resistance through mechanical deformation of the surface microstructure of the mycelium

摘要

The present invention relates to a method of reducing and determining the coefficient of friction of a mycelium to improve the many mechanical properties of the mycelium. In this method, the first mycelium layer is contacted with a polishing and pressure device for smoothing and deforming the microstructure of the mycelium. Smoothing the mycelium microstructure improves the abrasion resistance of the mycelium by reducing the coefficient of friction of the mycelium. The coefficient of friction of the mycelial surface reduced by smoothing the mycelial surface is determined using the tilt angle mechanism.