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MACHINING APPARATUS FOR LASER MACHINING A WORKPIECE, METHOD FOR LASER MACHINING A WORKPIECE

机译:用于激光加工工件的加工装置,激光加工工件的方法

摘要

A machining apparatus for laser machining a workpiece, in particular for laser cutting, is provided, having a device for generating a machining laser beam, for rough machining the workpiece, in particular for producing cuts with cut edges in the workpiece, and having a device for splitting the machining laser beam into at least two energy intensity ranges, wherein a first energy intensity range for rough machining of the workpiece has a greater time-integrated radiation energy than at least one second energy intensity range for at least partially fine machining a cut edge. Further provided is a method for laser machining a workpiece.
机译:提供一种用于激光加工工件的加工装置,特别是用于激光切割,该装置具有用于产生加工激光束的装置,用于粗加工工件,特别是用于在工件中产生切割边缘,并且具有装置为了将加工激光束分成至少两个能量强度范围,其中用于工件的粗糙加工的第一能量强度范围具有比至少一个第二能量强度范围更大的时间集成辐射能量,以至少部分精细加工切割边缘。进一步提供的是激光加工工件的方法。

著录项

  • 公开/公告号WO2021053105A1

    专利类型

  • 公开/公告日2021-03-25

    原文格式PDF

  • 申请/专利权人 BYSTRONIC LASER AG;

    申请/专利号WO2020EP76033

  • 发明设计人 WORATZ COLIN;

    申请日2020-09-17

  • 分类号B23K26/067;B23K26/38;G02B6;

  • 国家 EP

  • 入库时间 2022-08-24 17:56:57

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