A binding apparatus includes a binding tool, a binding tool driver, a shaft, and control circuitry. The binding tool is configured to execute a first binding process at a first binding position on a sheet bundle and execute a second binding process at a second binding position different from the first binding position on the sheet bundle. The binding tool driver includes a driver and is configured to apply a driving force to move the binding tool and a driving force to execute the first binding process and the second binding process. The shaft is disposed between the binding tool and the binding tool driver to support a movement of the binding tool by application of the driving force to the first binding position and the second binding position.
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