The present invention provides a heat transfer form for PC slab production, which allows uniform and rapid heat generation and excellent thermal conductivity in a mold when manufacturing a PC slab to shorten curing time, improve quality, and increase electrical energy efficiency. A heat transfer form for manufacturing a PC slab according to a preferred embodiment of the present invention includes: a slab bottom supporting steel plate having the same cross-sectional shape corresponding to the bottom surface shape of the PC slab and supporting the bottom surface of the PC slab; A heat conduction pipe disposed in contact with the bottom surface of the slab floor supporting steel plate; A heating wire installed inside the heat conduction pipe and electrically generating heat; A heat fluid filled in the heat conduction pipe and heated by heat generated from an electric heating wire; It characterized in that it includes; a formwork insulation plate disposed under the slab floor support steel plate and installed to contact the heat conduction pipe.
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