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DETECTION OF AN ELECTRIC ARC HAZARD RELATED TO A WAFER

机译:检测与晶片相关的电弧危险

摘要

A method, a non-transitory computer readable medium, and a detection system are provided for detecting an electric arc hazard associated with a wafer. The detection system may include a measurement unit, an electrode, and a processing unit. The measurement unit may be configured to provide a measurement result by measuring the electrical parameters of the electrode during the test period, during which the wafer can be moved relative to the electrode, and during that test period, a specific electric field between the electrode and the wafer A specific electric field, which may be formed between, induces the detached ends of the partially detached conductive elements of the wafer to move away from the wafer. The processing unit may be configured to determine the presence of an electric arc hazard based on the measurement result.
机译:提供一种方法,非暂时性计算机可读介质和检测系统,用于检测与晶片相关联的电弧危险。检测系统可以包括测量单元,电极和处理单元。测量单元可以被配置为通过在测试时段期间测量电极的电参数来提供测量结果,在此期间晶片可以相对于电极移动,并且在该测试时段期间,电极之间的特定电场晶片是可以形成在晶片的部分分离导电元件的拆卸端部的特定电场,以远离晶片移动。处理单元可以被配置为基于测量结果确定电弧危险的存在。

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