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CHIP WIRING LAYER TEMPERATURE SENSING CIRCUIT, TEMPERATURE SENSING METHOD AND CHIP THEREOF

机译:芯片布线层温度传感电路,温度传感方法及芯片

摘要

This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.
机译:本发明公开了一种芯片布线层温度感测电路,温度传感方法,芯片立体温度传感器及其芯片。芯片布线层温度传感电路包括金属布线温度检测模块,脉冲延迟检测模块和温度过渡模块;其中金属布线层温度检测模块设置在芯片的金属布线层的金属互连结构上;并且金属互连结构电连接到脉冲延迟检测模块;其中脉冲延迟检测模块包括系统高速时钟,在通过系统高速时钟检测到的金属布线温度检测模块的脉冲之后产生的延迟数据,并且将延迟数据发送到温度转换模块;其中温度转换模块根据延迟数据计算金属布线层的温度。

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