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EVEN/ODD DIE AWARE SIGNAL DISTRIBUTION IN STACKED DIE DEVICE
EVEN/ODD DIE AWARE SIGNAL DISTRIBUTION IN STACKED DIE DEVICE
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机译:堆叠芯片设备中的偶数/奇怪模具意识信号分布
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摘要
An electronic device includes a die stack having a plurality of die. The die stack includes a die parity path spanning the plurality of die and configured to alternatingly identify each die as a first type or a second type. The die stack further includes an inter-die signal path spanning the plurality of die and configured to propagate an inter-die signal through the plurality of die, wherein the inter-die signal path is configured to invert a logic state of the inter-die signal between each die. Each die of the plurality of die includes signal formatting logic configured to selectively invert a logic state of the inter-die signal before providing it to other circuitry of the die responsive to whether the die is designated as the first type or the second type.
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