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IMMERSION COOLING WITH WATER-BASED FLUID USING NANO-STRUCTURED COATING

机译:使用纳米结构涂层用水基流体浸没冷却

摘要

A method includes coating, via chemical vapor deposition, electronics disposed on a printed circuit board (PCB) with an electrical insulation coating of between one micron to 25 microns. The method further include depositing, on the electrical insulation coating, a metallic nano-layer comprising a porous metallic nano-structure. The method further includes, after the coating and the depositing, immersing the PCB in a water-based fluid to cool the electronics while the electronics are powered on.
机译:一种方法包括通过化学气相沉积,通过化学气相沉积,设置在印刷电路板(PCB)上的电子器件,电绝缘涂层在一个微米到25微米之间。该方法还包括在电绝缘涂层上沉积,金属纳米层包含多孔金属纳米结构。该方法还包括在涂覆和沉积之后,将PCB浸入水基流体中以冷却电子设备,而电子器件电源接通。

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