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Hermeticity Testing of an Optical Assembly

机译:光学组件的密闭性测试

摘要

A method for testing an optical assembly (1) which has an optical microstructure (3) integrated with a substrate (2). The optical microstructure (3) is positioned to form an external optical interaction area (4) on a part of a surface (5) of the substrate (2). A cover cap (6) seals at least a part of the surface (5) of the substrate (2) adjacent to the optical microstructure (3) to obtain a sealed cavity (9). An optical feedthrough (10) is integrated in the substrate (2) to form an external communication path from within the sealed cavity (9). The optical feedthrough (10) allows communication of a physical parameter value which is measured inside the sealed cavity (9) to outside the sealed cavity (9). The physical parameter value is associated with a measure of hermeticity of the sealed cavity (9).
机译:一种用于测试具有与基板( 2)集成的光学组织( 3 )的光学组件( 1 )的方法。光学微观结构( 3 )定位成在表面( 5 )底物( 2 )。盖帽( 6 )密封与光学微结构相邻的基板( 2)的表面( 5℃)的至少一部分( 3 )以获得密封腔( 9 )。光学馈通( 10 )集成在基板( 2 / b>)中,以形成来自密封腔内的外部通信路径( 9 )。光学馈通( 10 )允许将物理参数值的通信在密封腔内的密封腔( 9 )内部的通信( 9 )。物理参数值与密封腔的气密性的度量相关联( 9 )。

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