process for verleimen or bonding of good, such as wood, in the electric hochfrequenzfeld

• 1. method and device for verleimen or bonding of good, such as wood, in the electric hochfrequenzfeld [P] . 德国专利： DE000000882133B . 1953-07-06

  机译： 用于在电动霍克弗赖肯茨费尔德制造或粘合货物（例如木材）的方法和设备

• 2. establishment of the verleimen or bonding of good, such as wood, in the electric hochfrequenzfeld [P] . 德国专利： DE000000882487B . 1953-07-09

  机译： 在电动hochfrequenzfeld中建立Verleimen或粘合好物品，例如木材

• 3. process for verleimen of good, in particular wood, in the electric hochfrequenzfeld. [P] . 瑞士专利： CH295760A . 1954-01-15

  机译： 好用的木料，特别是木材的加工方法。

• 1. In-situ continuous process for bonding glass-fiber reinforced polypropylene to wood [C] . Karthik Ramani ASME international mechanical engineering congress and exposition . 1999
• 2. Development of polyvinyl alcohol/wood-derived carbon thin films: Influence of processing parameters on mechanical, thermal, and electrical properties [D] . Nan, Nan. 2016
• 3. The Role of Mineral Sea Water Bonding Process with Graphite-Aluminum Electrodes as Electric Generator [O] . Satryo B. Utomo, Winarto, Agung S. Widodo, 2019
• 4. Wafer Bonding: Solution‐Processed‐ZnO‐Mediated Semiconductor Bonding with High Mechanical Stability, Electrical Conductivity, Optical Transparency, and Roughness Tolerance (Adv. Mater. Interfaces 22/2019) [O] . Tatsushi Yamashita, Soichiro Hirata, Ryoichi Inoue, 2019
• 5. Reaction Kinetics of Bond Exchange of Deformation and Damage Processes in Wood [R] . van der Put, T. A. C. M. 1986