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An electrically conductive plastic mass containing a metallic filler and process for preparing said filler

机译:包含金属填料的导电塑料块及其制备方法

摘要

An electrically conductive plastic mass comprises a plastic matrix holding in electrical particle to particle contact a metal filler comprising a finely divided conductive metal powder having a solid core of copper or iron coated with copper, and a continuous film of silver thereon. The metal powder is preferably 3.5-350 microns in size and at least 20% by volume of the metal powder is incorporated in the plastic matrix which may be thermosetting or thermoplastic resins and elastomers such as asphalts, polyvinyl chlorides, polyurethanes, epoxies, polyamides, acrylate and natural rubber. Other fillers such as asbestos, bentonite, pigments, silica, alumina, titania and zinc oxide may also be incorporated in the plastic matrix. Examples of the following compositions are given: (a) 11 parts by weight of diglycidyl ether of bisphenol A and 89 parts silver coated copper powder mixed with 11 parts of a polyamide and 89 parts of silver coated copper powder. (b) 89 parts of silver coated copper powder and 11 parts of polyvinyl chloride plastisol with a curing temperature of 330 DEG F. (c) 80 parts of copper coated iron powder coated with silver and 20 parts of polyvinyl chloride plastisol.ALSO:A powder metal filler for incorporation in a plastic matrix is produced by a replacement plating process in which copper particles are continuously agitated in a silver plating solution containing 2-10 ozs./gallon silver ions and 8-22 ozs./gallons cyanide ions. Alternatively iron powder may be replacement plated with copper from a copper sulphate solution followed by replacement plating with silver from a solution containing 3-8 ozs./gallon silver ions and 6-20 ozs./gallon cyanide ions, the gm. moles of copper deposited. A film of gold may be formed on the silver coating and the coated particles may be ball milled or fluxed and fused to consolidate the silver film. The preferred size of the metal powder is 3.5-350 microns and an electrically conducting plastic mass is made by incorporating at least 20% by volume of the metal filler in a plastic matrix such as thermosetting or thermoplastic resins and elastomers. Examples of the matrix materials are asphalts, polyvinyl chlorides, polyurethanes, epoxies, polyesters, polyamides, acrylates and natural rubber.ALSO:A conductive plastic composition comprising 89 parts by weight of a powder having a core of copper or copper coated iron and an outer coating of silver (see Division C7) and 11 parts by weight of polyvinyl chloride plastisol is spread on to a 30 mesh 10 mil aluminium wire screen and cured. The reinforced sheet is then rolled to form electrically conductive gaskets for sealing microwave flanges.
机译:导电塑料块包括保持在电颗粒中以使颗粒接触的塑料基质,所述金属填充物包括细分的导电金属粉末,所述导电金属粉末具有铜或铁的实心核,所述铜或铁的实心核包覆有铜,并且其上连续形成银膜。所述金属粉末的尺寸优选为3.5-350微米,并且将至少20%(体积)的金属粉末掺入塑料基质中,所述塑料基质可以是热固性或热塑性树脂和弹性体,例如沥青,聚氯乙烯,聚氨酯,环氧树脂,聚酰胺,丙烯酸酯和天然橡胶。也可以在塑料基质中加入其他填料,例如石棉,膨润土,颜料,二氧化硅,氧化铝,二氧化钛和氧化锌。给出以下组合物的例子:(a)11重量份双酚A的二缩水甘油醚和89重量份涂银的铜粉与11重量份聚酰胺和89重量份涂银的铜粉混合。 (b)89份涂银铜粉和11份固化温度为330°F的聚氯乙烯增塑溶胶。(c)80份涂银的铜铁粉和20份聚氯乙烯增塑溶胶。ALSO:A用于塑料基体中的粉末金属填料是通过置换电镀工艺生产的,在该工艺中,铜粒子在含有2-10盎司/加仑银离子和8-22盎司/加仑氰化物离子的镀银溶液中连续搅拌。或者,可以用硫酸铜溶液中的铜置换镀铁粉,然后用含有3-8盎司/加仑银离子和6-20盎司/加仑氰化物离子(gm)的溶液置换镀银。摩尔的铜沉积。可以在银涂层上形成金膜,并且可以将球磨或助熔并熔合涂覆的颗粒以固结银膜。金属粉末的优选尺寸为3.5-350微米,并且通过将至少20体积%的金属填料掺入塑料基质例如热固性或热塑性树脂和弹性体中来制备导电塑料块。基体材料的例子是沥青,聚氯乙烯,聚氨酯,环氧树脂,聚酯,聚酰胺,丙烯酸酯和天然橡胶。ALSO:一种导电塑料组合物,包含89重量份的粉末,其粉末具有铜或覆铜铁芯,外层将银涂层(请参阅C7部分)和11重量份的聚氯乙烯增塑溶胶涂在30目10密耳铝丝网上并固化。然后将增强的片材卷起以形成用于密封微波法兰的导电垫片。

著录项

  • 公开/公告号GB978606A

    专利类型

  • 公开/公告日1964-12-23

    原文格式PDF

  • 申请/专利权人 CHOMERICS INC.;

    申请/专利号GB19620024261

  • 发明设计人

    申请日1962-11-09

  • 分类号C08K3/08;H01B1/22;

  • 国家 GB

  • 入库时间 2022-08-23 15:34:40

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