process for the production of binder to manufacture multi-layered decklagenspaenegemischen marked with deep spanoberflaeche particleboard

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  机译： 带有粘结剂的制造方法，用于制造具有非常细的芯片表面积的多层板

• 4. improvements in processes for the production of panels, particleboard astruttura and binder for use in the composition [P] . NO154923C . 1987-01-14

  机译： 改进用于组合物中的面板，刨花板阿斯特拉图拉和粘合剂的生产工艺

• 5. improvements in processes for the production of particleboard panels structure and composition binder for use in it [P] . IT1170824B . 1987-06-03

  机译： 刨花板面板结构和用于其中的组合物粘合剂生产工艺的改进

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