procedure for the cables of a two-dimensional isolierstoffträger arranged metallic bodies and / or verlöten bodies with other metallic elements

摘要

1,221,231. Soldering. SIEMENS A.G. 23 Feb., 1968 [24 Feb., 1967], No. 8872/68. Heading B3R. In tinning or tinning- and soldering metal elements 2 on an insulating member 1 a layer of soft solder is applied to the member 1 at a temperature below that at which alloying of the solder with the elements takes place and then the layer is heated, in the presence of a flux, at a temperature at which alloying of the solder with the element takes place, whereby the solder shrinks on to the elements and alloys with the elements. The member 1 is a carrier plate of insulating material on the surface of which conducting elements 2 are etched having enlarged parts 2SP1/SP in which openings are provided for leads from a component 3. The plate 1 is cleaned to remove dirt and oxide and tin solder is sprayed on the plate to produce a porous layer shown over the region 4. Liquid flux is sprayed over the layer and the layer is heated by reducing a flame to cause alloying to take place between the elements 2, 2SP1/SP and the solder. The solder shrinks due to its surface tension from the insulating material on to the elements 2, 2SP1/SP as shown over the region 5, tins the conductors 2, 2SP1/SP and solder the leads of the component 3 to the conductors. Parts of the conductors it is desired not to tin may be covered with masks or templates. Circuit boards for telecommunications may be tinned or soldered and the final heating may employ hot air or radiant heating.