SLOW-WAVE CIRCUIT INCLUDING MEANDER LINE AND SHIELDING THEREFOR

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  机译： 挠性印刷电路板，包括弯曲部分，其焊接性能得到改善，因此其生产方法

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• 5. FREE GROUNDING FILM AND MANUFACTURING METHOD THEREFOR, AND SHIELDING CIRCUIT BOARD INCLUDING FREE GROUNDING FILM AND GROUNDING METHOD [P] . 美国专利： US2017251550A1 . 2017-08-31

  机译： 自由接地膜及其制造方法，以及包括自由接地膜和接地方法的屏蔽电路板

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