method and device for assembly of components, especially unterfuehrungstunnelschuessen

• 1. 胶囊型内窥镜的容纳盒、胶囊型内窥镜组件、胶囊型内窥镜组件的组装方法及胶囊型内窥镜组件的组装装置 [P] . 中国专利： CN103228196B . 2014.07.09
• 2. 胶囊型内窥镜的容纳盒、胶囊型内窥镜组件、胶囊型内窥镜组件的组装方法及胶囊型内窥镜组件的组装装置 [P] . 中国专利： CN103228196A . 2013-07-31
• 3. ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY [P] . 美国专利： US2009148720A1 . 2009-06-11

  机译： 电子部件装置，电子部件装置的制造方法，电子部件组装体以及电子部件组装体的制造方法

• 4. OPTICAL DEVICE, OPTICAL DEVICE ASSEMBLY, OPTICAL DEVICE AGGREGATE, OPTICAL ELEMENT FIXING MEANS, COMPONENTS OF OPTICAL DEVICE, MANUFACTURE METHOD FOR OPTICAL DEVICE, ASSEMBLY METHOD FOR OPTICAL DEVICE, MANUFACTURE METHOD FOR OPTICAL ELEMENT FIXING MEANS AND MANUFACTURE METHOD FOR COMPONENTS OF OPTICAL DEVICE [P] . 日本专利： JP2006058591A . 2006-03-02

  机译： 光学器件，光学器件组件，光学器件集合体，光学元件固定装置，光学器件的组件，光学器件的制造方法，光学器件的组装方法，光学器件的光学器件制造方法，装置和制造方法

• 5. Component assembly, assembly device for producing a component assembly and method for producing a component assembly [P] . 德国专利： DE102018222220A1 . 2020.06.25

• 1. Numerical methods for the magneto-mechanical coupling analysis of in-vessel components in Tokamak devices [J] . Xudong Li, Shejuan Xie, Cuixiang Pei, 力学快报(英文版) . 2019,第003期
• 2. Methods and Devices of Speckle-Noise Suppression (Review) [J] . Igor Kompanets, Nikolay Zalyapin 光学与光子学期刊（英文） . 2020,第010期
• 3. Methods and Results of Assessment of the Pulse Electrical Disturbances Influence on. Digital Devices Functioning [J] . Yury Parfenov, Boris Titov, Leonid Zdoukhov 物理科学与应用：英文版 . 2013,第006期
• 4. Optimization of the Plastic Injection Molding Parameters by Using the Taguchi Method to Prevent Jammed Components in the Assembly Process of Mechatronic Devices [C] . Ion Cristian Braga, Anisor Nedelcu International Congress of Automotive and Transport Engineering . 2017
• 5. Characterization of Semiconductor Nanocrystal Assemblies as Components of Optoelectronic Devices [D] . Malfavon-Ochoa, Mario 2017
• 6. Methods and Research for Multi-Component Cutting Force Sensing Devices and Approaches in Machining [O] . Qiaokang Liang, Dan Zhang, Wanneng Wu, 2014
• 7. Characterization of Semiconductor Nanocrystal Assemblies as Components of Optoelectronic Devices [O] . Malfavon-Ochoa Mario 2017
• 8. In the Matter of: Certain Probe Card Assemblies, Components Thereof and Certain Tested DRAM and NAND Flash Memory Devices and Products Containing Same. Investigation No. 337-TA-621 [R] . 2010

• 1. Determination of Correction Values of Operating Reliability of Assembly Components of the Assembly—Front Spinner Spinning Box (R1 Rieter) on the Basis of Operating Data [J] . Slobodan Stefanović ,Korabayev Sherzod Ahmadjonovich ,Shoxobiddinova Dilafruz Erkinzonqizi . 工程(英文)(1947-3931) . 2021,第11期
• 2. Detecting Urinary Bladder Contractions: Methods and Devices [J] . Jacob Melgaard ,Nico J. M. Rijkhoff . 传感技术（英文） . 2014,第4期
• 3. 光伏组件PID现象及PID修复装置作用研究 [C] . SHI Er-zhen ,史二祯 ,JIANG Kun . 2017国际工程科技发展战略高端论坛——清洁能源技术 . 2017
• 4. 基于组件依赖的软件按需组装方法研究 [A] . 刘欢 . 2018