composition based on polyethylene murissable stabilized by di (1 - methylheptadecyl) - alkylphenol and its production process

摘要

1408061 Crosslinking polyethylene SOUTHWIRE CO 29 Dec 1972 [29 Dec 1971] 60109/72 Heading C3P Curable compositions suitable for extruding on to electrical conductors comprise (a) an ethylene polymer, (b) a bisperoxide cross-linking agent of formula where R is methyl, phenyl, nitrophenyl or halophenyl, and (c) a 4-aliphatic hydrocarbyl 2,6- di - (1 - methylheptadecyl) phenol. The polymer may be a homopolymer or a copolymer of ethylene with propylene, butene, ethyl acrylate or vinyl acetate, or a mixture of polyethylene with polyvinyl chloride, polymethyl acrylate, polystyrene, copolymers of butadiene with styrene or acrylonitrile, neoprene, natural rubber or organopolysiloxanes. The compositions may also contain fillers, e.g. silica, carbon black, alumina and calcium silicate. The composition may be extruded on to conductors at 170‹ to 340‹ F. and cured by heating at 350‹ to 480‹ F. Examples describe the curing of compositions comprising polyethylene, carbon black and (1 and 3 to 5) tetramethyl isophthalyl di-t-butyl bisperoxide and 2,6 - di - (1 - methylheptyl) - 4- methylphenol, (2) tetramethyl isophthalyl di-tbutyl bisperoxide and 2,6-di-(1-methylheptyl)- 4-ethylphenol, (7 and 9 to 11) tetramethyl isophthalyl di-cumyl bisperoxide and 2,6-di-(1- methylheptyl) - 4 - methylphenol, and (8) tetramethyl isophthalyl di-cumyl bisperoxide and 2,6 - di - (1 - methylheptyl) - 4 - ethylphenol.