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method for determination of small quantities of welding for the establishment of contact elements for connecting elements for connecting the implementation

机译:确定少量焊接的方法,用于建立用于连接的连接元件的连接元件

摘要

An electrical conductor of relatively small cross section is provided with a loop at one end adapted to be dipped into a bath of molten solder, whereby a predetermined amount of solder adheres to the loop as a membrane, formed by capillary action. The conductor is thus provided with a known quantity of solder, so that the conductor may be soldered to a conductive element by application of a known quantity of heat, without requiring any additional solder to be supplied at the time of soldering. The solder membranes are formed continuously by an automatic process, and the conductors are soldered into fixed relation with conductive elements automatically by the application of heat and pressure from a soldering element.
机译:横截面相对较小的电导体在一端设有一个回路,该回路适于浸入熔融焊料的熔池中,由此预定量的焊料以膜的形式粘附在回路上,该薄膜是通过毛细管作用形成的。因此,导体具有已知量的焊料,从而可以通过施加已知量的热量将导体焊接至导电元件,而在焊接时不需要提供任何额外的焊料。焊料膜通过自动过程连续形成,并且通过施加来自焊料元件的热量和压力,导体自动地与导电元件焊接成固定关系。

著录项

  • 公开/公告号BE800376A

    专利类型

  • 公开/公告日1973-10-01

    原文格式PDF

  • 申请/专利权人 SIEMENS A.G. A BERLIN ET A MUNICH (ALLEMAGNE);

    申请/专利号BE19730131810

  • 发明设计人

    申请日1973-06-01

  • 分类号H01R;H05K;

  • 国家 BE

  • 入库时间 2022-08-23 07:46:54

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