A method for reducing the softening point of oxygen-free, sulfur-containing conductivity of copper and improvement of its electrical conductance

• 1. 一种无填充的高电导率无氧纯铜焊接装置及焊接方法 [P] . 中国专利： CN107984059A . 2018-05-04
• 2. 提高氩氧脱碳法制备含硫易切削不锈钢硫命中率的方法 [P] . 中国专利： CN104232842A . 2014-12-24
• 3. A method for reducing the softening point of oxygen-free, sulfur-containing conductivity of copper and improvement of its electrical conductance [P] . 德国专利： DE1558625B2 . 1972-09-28

  机译： 降低铜的无氧，含硫电导率的软化点并提高其电导率的方法

• 4. A method for reducing the softening temperature of oxygen-free copper and improvement of its electrical conductivity conductance [P] . 德国专利： DE1558625A1 . 1972-03-30

  机译： 降低无氧铜软化温度并提高其电导率的方法

• 5. METHOD FOR DECREASING THE SOFTENING TEMPERATURE AND IMPROVING THE ELECTRICAL CONDUCTIVITY OF HIGH CONDUCTIVITY OXYGEN-FREE COPPER [P] . 美国专利： US3525605A . 1970-08-25

  机译： 降低软化温度并提高高电导率无氧铜电导率的方法

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