Alloying gold - with nickel, iron and/or cobalt for gold and aluminium bonding

摘要

Electrically conductive junction Au and al, contacts, e.g. for transistors and integrated circuits between semi-conductor systems and casing, prepd. by ultrasonic- or heat-compression welding, contains Au alloyed with 3-7 (5) wt.% Ni, Fe and/or Co, at least at junction. Pref. the Au alloy is applied to substrate by electro- or chemical deposition, vaporising or spraying), to a substrate contg. Ni, Fe and/or Co. Before ultrasonic - or heat-compression welding, the Au-coated substrate is tempered, esp. =1 hr. at 500 degrees C in an N2-H2 atmos. (causing diffusion of Ni, Fe and/or Co into Au layer). Alloying reduces or prevents loss in strength and rise in resistance with heat-ageing.